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Ziitek takes you through a basic overview of the use of two-components thermally conductive gels

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Ziitek takes you through a basic overview of the use of two-components thermally conductive gels
Latest company news about Ziitek takes you through a basic overview of the use of two-components thermally conductive gels

Ziitek takes you through a basic overview of the use of two-components thermally conductive gels

 

Two-component thermal conductive gel is a special thermally conductive material composed of two different components with very good thermal conductivity and high temperature resistance. When the temperature of this thermally conductive gel increases, the two components react to form a new structure, giving it the properties of a thermally conductive gel and achieving a thermally conductive function. Its contact surface has good smoothness and heat dissipation performance, which can effectively reduce the thermal resistance of the product and improve the heat dissipation efficiency.

 

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In terms of application, two-component thermal conductive gel is widely used in various occasions that require heat dissipation, such as the driving power supply of LED bulbs, automotive electronic thermal conductive modules, and mobile phone processor heat dissipation. In these applications, two-component thermally conductive gels can effectively dissipate heat and avoid uneven heat dissipation or replacement issues in the power supply, resulting in cost savings for the business.

 

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In terms of usage, the two-component thermally conductive gel needs to be evenly mixed with A and B by hand or with a dispensing machine, and then applied to the hot location. After mixing, the thermally conductive gel will gradually cure over a certain period of time, becoming elastic and no longer changing in hardness.

 

In addition, the two-component thermal conductive gel is also environmentally friendly, and the prepared products do not contain dangerous toxic substances, ensuring that the operation process is safe and pollution-free. At the same time, its extremely low bonding pressure makes the installation process convenient, which can effectively reduce errors and safety hazards in the assembly process of electronic products.

 

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Pub Time : 2024-04-29 16:07:43 >> News list
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